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Broadband Electromagnetic Properties of Engineered Flexible Absorber Materials
Figures and relevant data from the paper "Broadband Electromagnetic Properties of Engineered Flexible Absorber Materials" are found here . The paper was published on Advanced Materials Technologies in 2023. ABSTRACT: Flexible and stretchable materials have attracted significant interest for applications in wearable electronics and bioengineering fields. Recent developments also incorporate mounted and embedded microwave circuits, components, and systems with engineered flexible materials that operate over a broadband frequency range (~1 to 100 GHz). Here we demonstrate a simple, low-cost, flip-chip technique where flexible materials are placed on top of coplanar waveguide (CPW) transmission lines for material property measurement. We apply on-wafer error correction and de-embedding techniques to determine broadband electromagnetic properties of the material-loaded transmission line segments. Finite-element simulations of material-loaded devices were employed along with the broadband measurements to estimate the electromagnetic material properties. To demonstrate this technique, we fabricated flexible polydimethylsiloxane (PDMS) composites with varying concentrations of Barium Hexaferrite (BaM) nanoparticles for potential applications in electromagnetic shielding and quantified the complex permittivity and permeability of the composites up to 110 GHz using our broadband scattering-parameter measurements. We fit the frequency-dependent permeability to models describing the ferromagnetic resonance of barium hexaferrite (BaM) nanoparticles in PDMS and estimated the constituent nanoparticle properties using the Maxwell-Garnett mixing model. This study paves way to exploit a wide range of engineered materials in flexible, wearable, and biomedical electronics applications and presents a convenient methodology to extract important broadband electromagnetic properties for applications such as electromagnetic shielding.
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Parametric simulations of microwave microfluidic measurement sensitivity to dielectric changes in polymer-fluid interfaces
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This data set contains data used to generate plots in the paper "Microwave Characterization of Parylene C Dielectric and Barrier Properties".It contains the broadband S-parameter measurements of Parylene C coated CPWs exposed to water and ionic fluid, simulation set-up files and RLCG results, formatted data for each of the plots, and scripts to generate each figure.Simulations must be opened using ANSYS Electronics Desktop.Scripts must be executed using MATLAB.See readme file for complete description of each individual file.
Parametric simulations of microwave microfluidic measurement sensitivity to dielectric changes in polymer-fluid interfaces
공공데이터포털
This data set contains data used to generate plots in the paper "Microwave Characterization of Parylene C Dielectric and Barrier Properties".It contains the broadband S-parameter measurements of Parylene C coated CPWs exposed to water and ionic fluid, simulation set-up files and RLCG results, formatted data for each of the plots, and scripts to generate each figure.Simulations must be opened using ANSYS Electronics Desktop.Scripts must be executed using MATLAB.See readme file for complete description of each individual file.
Data associated with the manuscript "Glass microwave microfluidic devices for broadband characterization of diverse fluids" submitted to the Special Issue of the International Microwave Symposium (IMS) 2024 of IEEE Transactions of Microwave Theory and Techniques.
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Abstract from manuscript:We demonstrate a glass microwave microfluidic device for determining the permittivity of a wide range of liquid chemicals from 100 MHz to 10 GHz with relatively low uncertainty. Conventional microwave microfluidic devices use polymer-based microfluidic layers for fluid delivery, but these polymers swell in organic solvents and are not suitable for many applications. Our device incorporates glass microfluidic channels with platinum coplanar waveguides to provide a solvent-resistant architecture for broadband dielectric spectroscopy of fluids. We utilize broadband S-parameter measurements with a vector network analyzer on a wafer probing station and multiline thru-reflect-line calibrations to extract the distributed circuit parameters of transmission lines and solve for fluid permittivity. In this work, we demonstrate the utility of the device by measuring the broadband permittivity of four organic solvents difficult to measure otherwise: hexane, heptane, decane, and toluene.
Data for "Distributed contactless interconnects for millimeter-wave heterogeneous integration"
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Included here are figures and other relevant data from the paper "Distributed contactless interconnects for millimeter-wave heterogeneous integration", submitted to TMTT Letters. Abstract: State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips electrically coupled to one another via bump bonds or wire-bond interconnects. While these interconnects are a mature technology for low-frequency operation (< 100 GHz), they have stringent fabrication requirements and are prone to failure during operation in the terahertz range (300 GHz to 10 THz). Next-generation integrated circuits require alternative interconnect topologies that are less sensitive to fabrication tolerances and conditions, are more robust, and have superior high-frequency performance. Here, we demonstrate distributed coupling to 325 GHz between broadside-coupled coplanar waveguides without bump bonds, wire bonds, or direct metal-to-metal bonding. The insertion loss of these contactless interconnects was approximately 1.4 dB at the maximum in the passbands at 63 GHz, 93 GHz, and 120 GHz. This interconnect topology enables robust integration of low-cost silicon with high-speed compound semiconductors for terahertz communications networks to improve reliability and increase yield.
Data for "Distributed contactless interconnects for millimeter-wave heterogeneous integration"
공공데이터포털
Included here are figures and other relevant data from the paper "Distributed contactless interconnects for millimeter-wave heterogeneous integration", submitted to TMTT Letters. Abstract: State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips electrically coupled to one another via bump bonds or wire-bond interconnects. While these interconnects are a mature technology for low-frequency operation (< 100 GHz), they have stringent fabrication requirements and are prone to failure during operation in the terahertz range (300 GHz to 10 THz). Next-generation integrated circuits require alternative interconnect topologies that are less sensitive to fabrication tolerances and conditions, are more robust, and have superior high-frequency performance. Here, we demonstrate distributed coupling to 325 GHz between broadside-coupled coplanar waveguides without bump bonds, wire bonds, or direct metal-to-metal bonding. The insertion loss of these contactless interconnects was approximately 1.4 dB at the maximum in the passbands at 63 GHz, 93 GHz, and 120 GHz. This interconnect topology enables robust integration of low-cost silicon with high-speed compound semiconductors for terahertz communications networks to improve reliability and increase yield.
Patent AT-E401766-T1: [Translated] MULTI-LAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND METHOD
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A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.
Data for "A distributed theory for contactless interconnects at terahertz frequencies"
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Included here are figures and other relevant data from the paper "A distributed theory for contactless interconnects at terahertz frequencies". Abstract: Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect?s performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.
Patent AT-E400990-T1: [Translated] DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS
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An apparatus for packaging electronic components, particularly integrated circuits, which includes a carrier tape into or on which the integrated circuits can be secured, a packing reel, to which is secured the carrier tape, wherein one or more components of the packing reel is composed of a plastic material and a desiccating material, and preferably a copolymer, and optionally an electrostatic dissipating product. The packing reel may further include a humidity indicating system. The apparatus may also be placed within a water and moisture-proof barrier bag for shipment purposes.
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