Patent AT-E399889-T1: [Translated] METHOD AND DEVICE FOR COATING A SUBSTRATE
공공데이터포털
The invention relates to a method for coating a substrate with a layer of a material, such as a metal, in which a quantity of electrically conductive material is vaporized in a space with a low background pressure and energy is supplied to the material which is to be vaporized in order to vaporize this material. According to the invention, the material which is to be vaporized, while it is being vaporized, is kept floating, without support, in the space and is enclosed in an alternating electromagnetic field, the alternating electromagnetic field being generated with the aid of a high-frequency alternating current. The invention also relates to a device for coating a substrate and to a substrate.
Patent AT-E400405-T1: [Translated] METHOD FOR PRODUCING A GRINDING ARTICLE
공공데이터포털
A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating composition, so that the abrasive coating composition substantially adheres only to the first portion of the backing.
Patent AT-E40148-T1: [Translated] METHOD OF BRINGING SURFACES TOGETHER BY APPLYING A POLYURETHANE OR POLYETHERAMIDE JOINT, SURFACIAL MELTING THAT JOINT AND COOLING THEM.
공공데이터포털
1. Process for assembling, by jointing, two surfaces A and B, these surfaces being made of various materials such als glass, plastics, metal etc., characterized in that it consists in : a) applying to the surface A a seal in the shape of a strip of a thermoplastic material, based on a polymer chosen from the group comprising thermoplastic polyurethanes, polyetheramides or mixtures of both these thermoplastic polymers, b) placing the surface A so as to face the surface B, via its seal, and c) producing the assembly by melting the surface layer of the seal which is facing the surfaces B, placing in contact and cooling under a slight pressure.