데이터셋 상세
미국
Data associated with "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C.
We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave electronics on the rise, reliable methods for measuring the electrical properties of dielectrics used in integrated circuits are critical. We outline an on-wafer method for extracting the permittivity of a 3D multilayer glass structure from 100 MHz to 30 GHz using S-parameter measurements of different calibration chips. Our method can be used to inform better design of metrology for dielectric materials for 3D integrated circuit technologies.This is data associated with the manuscript "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C. The manuscript is currently under review by ERB in the NPS system under PUB ID 957051 / N2024-0193
연관 데이터
Data associated with "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C.
공공데이터포털
We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave electronics on the rise, reliable methods for measuring the electrical properties of dielectrics used in integrated circuits are critical. We outline an on-wafer method for extracting the permittivity of a 3D multilayer glass structure from 100 MHz to 30 GHz using S-parameter measurements of different calibration chips. Our method can be used to inform better design of metrology for dielectric materials for 3D integrated circuit technologies.This is data associated with the manuscript "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C. The manuscript is currently under review by ERB in the NPS system under PUB ID 957051 / N2024-0193
Data associated with the manuscript "Glass microwave microfluidic devices for broadband characterization of diverse fluids" submitted to the Special Issue of the International Microwave Symposium (IMS) 2024 of IEEE Transactions of Microwave Theory and Techniques.
공공데이터포털
Abstract from manuscript:We demonstrate a glass microwave microfluidic device for determining the permittivity of a wide range of liquid chemicals from 100 MHz to 10 GHz with relatively low uncertainty. Conventional microwave microfluidic devices use polymer-based microfluidic layers for fluid delivery, but these polymers swell in organic solvents and are not suitable for many applications. Our device incorporates glass microfluidic channels with platinum coplanar waveguides to provide a solvent-resistant architecture for broadband dielectric spectroscopy of fluids. We utilize broadband S-parameter measurements with a vector network analyzer on a wafer probing station and multiline thru-reflect-line calibrations to extract the distributed circuit parameters of transmission lines and solve for fluid permittivity. In this work, we demonstrate the utility of the device by measuring the broadband permittivity of four organic solvents difficult to measure otherwise: hexane, heptane, decane, and toluene.
Data for "A distributed theory for contactless interconnects at terahertz frequencies"
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Included here are figures and other relevant data from the paper "A distributed theory for contactless interconnects at terahertz frequencies". Abstract: Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect?s performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.
Data for "Characterizing Interconnects to 325 GHz" to be submitted to "Transactions on Microwave Theory and Techniques"
공공데이터포털
Included here are figures and other relevant data from the paper "Characterizing Interconnects to 325 GHz". Abstract: We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally validated our method with distributed contactless interconnects in the form of broadside coupled coplanar waveguides as a test case. We find excellent agreement between experiment, full-wave simulations, and a distributed model of contactless interconnects. This work provides a rigorous method to accurately characterize interconnects when conventional approaches are not applicable.
Microwave oven interference measurements at 2.4 GHz
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The 2.4 GHz ISM band is shared by Wi-Fi, Bluetooth, Wireless HART, ISA100.11a, and several other industrial wireless systems. This band also includes microwave ovens which produce interference that disrupt communications within their vicinity, therefore, understanding and monitoring for interference from these types of radio emissions sources is crucial to ensure an optimal wireless user experience. Microwave ovens are common radio interference sources that disrupt the operation of the wireless networks in industrial environments. While avoiding these types of emissions would be an ideal solution, human practicalities often make the elimination of microwave ovens impossible. Therefore, understanding the properties of this common radio emission is necessary. A real-time spectrum analyzer (RTSA) was used to capture complex baseband recordings of radio frequency emissions of three different microwave ovens at 2.45 GHz. The measurement data herein may be used to replicate the interference in a laboratory setting and thereby allowing industrial wireless network integrators to evaluate the performance of their wireless networks operating concurrently with this type of interference.Disclaimer: Certain commercial equipment, instruments, or materials are identified in this publication in order to describe the experimental procedures and data adequately. Such identification is not intended to imply recommendation or endorsement by the National Institute of Standards and Technology, nor is it intended to imply that the materials or equipment identified are necessarily the best available for the purpose.
LABORATORY-BASED REFERENCE CHANNELS FOR MILLIMETER-WAVE WIRELESS DEVICE MEASUREMENTS
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This dataset is for the publication entitled "LABORATORY-BASED REFERENCE CHANNELS FOR MILLIMETER-WAVE WIRELESS DEVICE MEASUREMENTS." The dataset includes results from experiments in a simulated industrial wireless channel operated at 28 GHz. Results include synthetic-aperture beamforming data, and error-vector-magnitude information calculated from synthetic-aperture and directional-antenna measurements.
과학기술정보통신부 국립전파연구원 안테나 고속측정시스템 유효성 연구
공공데이터포털
2022 자체연구보고서 최근 모바일 트래픽 증가 및 데이터 전송률 증가에 따라 세계 여러 나라에서는 밀리미터파 대역에 이동통신 서비스를 적용하고자 하는 분위기가 조성되 었다 하지만 밀리미터파 대역은 높은 전송 손실 등의 문제를 가지고 있어 이동통신 서비스로 사용하기 위해 다수의 안테나를 배열하여 온 칩 형태로 집적한 모듈형 대용량 빔포밍 안테나를 적용한 제품이 개발되는 추세이다 형태로 개발되는 제품은 분리 측정이 어렵기 때문에 제품인증을 위한 전자파 적합성 시험에서는 실제 통신환경에서의 방사 성능을 검증하는 와 같은 새로운 측정방법이 도입 되었다
Interlaboratory comparison of cavity resonator measurements for complex permittivity to 170 GHz
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Figure data for "Interlaboratory comparison of cavity resonator measurements for complex permittivity to 170 GHz"ABSTRACT:Standards provide known right answers traceable to National Metrology Institutes. Today, no such complex permittivity standard exists, let alone one traceable to the International System of Units (SI). In response, a consortium of industrial, academic, and government laboratories - led by the International Electronics Manufacturing Initiative (iNEMI) - performed an interlaboratory comparison to understand the impact of this problem and how a new standard could help. The goal of the comparison was to benchmark the best-case interlaboratory agreement in complex permittivity measurements up to 170 GHz and provide some industry-led guidance for making the standard useful. The consortium used four different types of commercial resonators from 10 GHz to 170 GHz. Here, we show how we improved the best-case repeatability and interlaboratory agreement of these resonator measurements. We leverage the broader capabilities of nine industry (e.g., Intel, Panasonic, 3M) and government (e.g., NIST, ITRI) labs worldwide in the four interlaboratory comparisons presented here. These interlaboratory comparisons quantify interlaboratory agreement and incorporate stakeholder feedback to develop a fit-for-purpose standard for complex permittivity.
Data for "Preparing for 6G: Developing best practices and standards for industrial measurements of low-loss dielectrics"
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Data for "Preparing for 6G: Developing best practices and standards for industrial measurements of low-loss dielectrics"