Disclosed is a support for a lithographic printing plate which, when measured over a 400 µm x 400 µm surface region thereon using a three-dimensional non-contact roughness tester, has at most 5.0 convex portions of a height from centerline of at least 0.70 µm and an equivalent circle diameter of at least 20 µm, and has at least 800 concave portions of a depth from centerline of at least 0.50 µm and an equivalent circle diameter of at least 2.0 µm. Presensitized plates which are obtainable by using the support for a lithographic printing plate according to the present invention have an excellent scumming resistance and an extremely long press life.

The invention provides a planographic printing plate precursor including a photosensitive layer containing an infrared absorbent, a polymerization initiator, a polymerizable compound, and a binder polymer, and a protective layer containing an inorganic layered compound, formed in this order on a surface of a hydrophilic aluminum support, wherein at least one of the photosensitive layer and the protective layer contains a phosphonium compound.

A planographic printing plate precursor comprises: a support; and a recording layer disposed on the support, the recording layer comprising a lower layer and an upper layer disposed on the lower layer, wherein the lower layer contains a resin having in a main chain structure a phenol skeleton and a urea bond, the upper layer contains a water-insoluble alkali-soluble resin and an infrared absorber, and the solubility of the upper layer in an aqueous alkali solution is increased by exposure. The planographic printing plate precursor can be produced directly through scanning exposure based on digital signals. It is superior in reproducibility of highly fine images and also superior in printing durability and chemical resistance of small-area image areas such as halftone dots and thin lines.

The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Multilayer materials for producing packaging, comprising at least 2 films and a layer printed with a printing ink, the printing ink comprising a hyperbranched polyester containing functional groups; a printing ink comprising a polyester containing functional groups; and the use of said printing ink for producing multilayer materials.

A flat display device including a display region disposed between a substrate and a sealing substrate that are coupled together by a sealing member, an electrical element that is electrically coupled with the display region, and at least one reinforcing member that increases the strength of a region where it is located. The reinforcing member is mounted at at least one side of the electrical element.

A high speed non-contact beam scanning device sized and shaped to provide the ergonomic benefits of a pen or wand, yet can scan a wide angle moving beam across an information-bearing target in one or two dimensional scan patterns such as lines, rasters or other patterns in order to read information therefrom. The device is well suited for reading one or two dimensional bar-code or other printed matter. In order to achieve the high density optical packaging necessary for its high performance to size benefits the device employs a novel in-line or "axial" gyrating, or "axial" scan element. The axial scan element can accept an input light beam at one end and cause it to emerge from its opposite end as a scanned beam, propagating in the same general forward direction it had upon entering the element. Reflected light, which carries information contained on the target, is collected by an internal non-imaging light concentrator and is processed by signal processing electronics. All components are integrated into a thin low mass module small enough to fit in a pen. Communication from the device is achievable by a cable or by wireless transmission.

A method of selective plating a component such as a header (3), wherein the header (3) is mounted in a jig (7), a resilient silicone rubber mask (1) having a stepped plating aperture (2) is press fitted to the cap (4) of the header (3) and a beading (12) of the jig (7) so as to expose only the end face of the cap (4) and the ends of the lead wires (5) of the header (3), the assembly is inverted over a plating tank in a selective plating machine, the end face of the cap (4) and the lead wire ends (5) are selectively plated, for example with gold, and the resilient mask (1) is peeled away from the header (3).

A method of selective plating a component such as a header (3), wherein the header (3) is mounted in a jig (7), a resilient silicone rubber mask (1) having a stepped plating aperture (2) is press fitted to the cap (4) of the header (3) and a beading (12) of the jig (7) so as to expose only the end face of the cap (4) and the ends of the lead wires (5) of the header (3), the assembly is inverted over a plating tank in a selective plating machine, the end face of the cap (4) and the lead wire ends (5) are selectively plated, for example with gold, and the resilient mask (1) is peeled away from the header (3).

The present invention relates to an ink composition and a respective varnish, suitable for use in heatset printing, in particular heatset web offset printing, which is suited to avoid fluting during the printing process. The ink composition comprises at least one solvent having a boiling point of from 200°C to 240°C which is present in an amount suited to allow the ink composition to dry at a printed web temperature of from 40°C to 60°C during the printing process to avoid fluting.